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Description
Two rubber toughened structural adhesives with superior peel, impact and fatigue resistance suitable for bonding a wide range of substrates.
Specifications
Item Type
Epoxy & Structural Adhesives
Manufacturer
ITW Polymers Adhesives
Color
Thick White
Composition
Tris-2, 4, 6(dimethylaminomethyl) Phenol, Amorphous Silicon-Dioxide, Butadiene AScrylonitrile Copolymer
Container Size
400 mL
Container Type
Cartridge
Curing Time
30 hr
For Use On
Ceramic, Glass and FRP Composite, Metals, Rigid Plastic and Wood
Functional Cure
205 to 215 min
Mixing Ratio
12/30/1899 1:01:00 AM, 1:1
Series
Epoxy Plus 25
Temperature Range
-40 to 200 deg F
Features
- Non-corrosive
- Ideal for potting and encapsulating electronic components
Additional Info
UNSPSC
31201607